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- 1. Signal & Power Integrity For Single-Multi Die, Interposer & Packaging
- 2. Chip I/O & Functional Block Modeling & Validation Solutions
- 3. Integrating Photonic & Wireless In Electrical Design
- 4. System Co-Design: Modeling, Simulation & Measurement Validation
- 5. Advances In Materials & Processing For PCBs, Modules & Packages
- 6. Applying Chip-To-Chip & Advanced PCB Design & Simulation Techniques
- 7. Advanced I/O Interface Design For Memory & 2.5D/3D/SIP Integrations
- 8. Optimizing High-Speed Serial Design
- 9. Measurement, Simulation & Optimization Of Jitter, Noise & Timing To Minimize Errors
- 10. High-Speed Signal Processing, Equalization & Coding
- 11. Power Integrity In Power Distribution Networks
- 12. Electromagnetic Compatibility/Mitigating Interference
- 13. Applying Test & Measurement Methodology
- 14. Modeling & Analysis Of Interconnects
- 15. Machine Learning For Microelectronics, Signaling & System Design
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