Panel – 112-Gbps Electrical Interfaces: An OIF Update on CEI-112G

Thu. January 31| 3:45 PM - 5:00 PM | Ballroom G

Pass Type: 2-Day Pass, All Access Pass, Alumni All Access Pass, Boot Camp Pass, Expo Pass

Track: 08. Optimizing High-Speed Serial Design

Audience Level: All

Session Type: Panel Discussion (Free)

Description: A panel of OIF contributors will discuss the ongoing, multi-faceted CEI-112G interface effort, the eighth generation of industry enabling electrical interfaces defined by the OIF. The panel will provide an update on the multiple interfaces being defined by the OIF including CEI-112G MCM, XSR, VSR, MR and LR for 112G. Applications of these include die-to-die, chip-to-module, chip-to-chip and long reach over backplane and cables. Listen to thought leaders in the electrical interface industry debate the issues surrounding the CEI-112G projects and the architectures they will enable.

Takeaway: The audience should learn what the CEI-112G family of Interoperability Agreements (IAs) are, where they came from, how they are used, and the state of development of these IAs. They should also gain some sense of the intense implementation, use and measurement challenges associated with CEI-112G.


Speakers

Brian Holden

Brian Holden

VP of Standards, OIF PLL MA&E Co-Chair

Kandou Bus SA

Role: Speaker

Steve Sekel

Steve Sekel

400G/800G Specialist, OIF PLL Interoperability Chair

Keysight Technologies

Role: Speaker

Cathy Liu

Cathy Liu

R&D Director, OIF Board Member

Broadcom

Role: Speaker

Nathan Tracy

Nathan Tracy

Technologist, OIF VP of Marketing

TE Connectivity

Role: Speaker