Panel – 112-Gbps Package Challenges

Tue. January 29| 4:45 PM - 6:00 PM | Ballroom G

Pass Type: 2-Day Pass, All Access Pass, Alumni All Access Pass, Boot Camp Pass, Expo Pass

Track: 05. Advances in Materials & Processing for PCBs, Modules & Packages

Audience Level: All

Session Type: Panel Discussion (Free)

Description: 100Gbps Ethernet (IEEE 802.3ck) and OIF CEI 112Gbps specifications have pushed the Nyquist frequencies to 26.56GHz and 28GHz. This means that device and system vendors need to re-evaluate their bandwidth requirements and link configurations such as: reduction of channel budget due to extra insertion loss consumed by packages, device/package/PCB co-optimizations, package impedance choices, and consideration of package's PVT variations. In this panel, we would like to discuss the impacts, challenges, technology outlook, and solutions with experts from various areas including device/package design, standards, test and measurement, system builders, and 3D EM modeling.

Takeaway: The audience will gain the knowledge on package requirements and challenges at 112Gbps and beyond.


Speakers

Hsinho Wu

Hsinho Wu

Designer Engineer

Intel Corp.

Role: Speaker

Masashi Shimanouchi

Masashi Shimanouchi

Design Engineer

Intel Corp.

Role: Speaker

Adee Ran

Adee Ran

Principal Engineer

Intel

Role: Speaker

Richard Mellitz

Richard Mellitz

Distinguished Engineer

Samtec

Role: Speaker

Yuriy Shlepnev

Yuriy Shlepnev

President

Simberian Inc.

Role: Speaker

Mike Resso

Mike Resso

Signal Integrity Application Scientist

Keysight Technologies

Role: Speaker