Signal/Power Integrity Optimizations in an IoT Automotive Package
Thu. January 31| 10:00 AM - 10:45 AM | Ballroom A
Pass Type: 2-Day Pass, All Access Pass, Alumni All Access Pass
Track: 01. Signal & Power Integrity for Single-Multi Die, Interposer & Packaging
Audience Level: All
Session Type: Technical Session
Takeaway: Harsh operating environments drive design decisions that impinge signal and power integrity performance. Mitigation options for SI and PI directly oppose one another, necessitating a close cooperation between SI and PI design efforts to optimize performance from a full-system perspective rather than to work in isolated silos.