Simplify & Validate: A Single Structure Approach for Separate PCB Dielectric & Conductor Roughness Loss Characterization

Thu. January 31| 10:00 AM - 10:45 AM | Ballroom B

Pass Type: 2-Day Pass, All Access Pass, Alumni All Access Pass

Track: 14. Modeling & Analysis of Interconnects

Audience Level: All

Session Type: Technical Session

Description: To find out the reasons for possible PCB manufacturing failure due to losses, a new easy-to-use production floor technique with separation of dielectric, conductor and roughness effects is needed. This paper presents a novel method that identifies material properties using just one structure and one TDR/TDT measurement. The post-processing of the measurement extracts the frequency-dependent models for dielectric, conductor, and copper surface roughness. The proposed technique is called XMOT (eXtract and MOnitor PCB material properties using a T-resonator only). It can be used to collect the statistics of the material variations during manufacturing and monitor changes in dielectric and conductor roughness properties.

Takeaway: We are proposing a novel method which identifies material properties and differentiates conductor and dielectric losses using one structure only: asymmetrical T-resonator. This approach requires only one measurement in the time-domain. Just using one structure we can get information on transmission line properties and resonator response at the same time.


Speakers

Yasin Damgaci

Yasin Damgaci

Signal Integrity Engineer

Hewlett Packard Enterprise

Role: Speaker

YongJin Choi

YongJin Choi

Master Technologist

Hewlett Packard Enterprise

Role: Speaker

Christopher Cheng

Christopher Cheng

Distinguished Technologist

Hewlett Packard Enterprise

Role: Speaker

Yuriy Shlepnev

Yuriy Shlepnev

President

Simberian Inc.

Role: Speaker