Distributed Decoupling Capacitors Application for PDN Designs of Fine Pitch BGA Products

Thu. January 31| 11:00 AM - 11:45 AM | Ballroom B

Pass Type: 2-Day Pass, All Access Pass, Alumni All Access Pass

Track: 11. Power Integrity in Power Distribution Networks

Audience Level: All

Session Type: Technical Session

Description: The electronics market is rapidly moving toward product minimization.The drive for low power, high-efficiency and fastest performance is forcing the designers to adopt fine pitch BGA, micro CSPs and micro BGAs technologies. Discreet decoupling capacitors, used to control PDN impedance at MHz to GHz frequency band for years, are unsuitable for contemporary products of BGA pitch below 0.8 [um]. We hereby examine the use of distributed capacitors based on thin and ultra-thin film laminates for controlling PDN impedance of fine-pitch BGA designs, along with other approaches such as Si-based capacitors and distributed capacitors of standard laminates. The resulting power integrity simulation and PDN lab measurements are presented. Practical design aspects, benefits and limitations are discussed.

Takeaway: Using discreet decoupling capacitors under BGA is no longer a feasible solution for the new generation of products as the BGA pitch is below 0.8 [um]. Here we examine the use of distributed capacitors based on thin film laminates for controlling PDN impedance at the MHz to GHz frequency band of fine pitch BGA design.


Speakers

Amiram Jibly

Amiram Jibly

Senior SI Engineer

Intel

Role: Author

Igal Fridman

Igal Fridman

Hardware Engineer

Major Technology Company

Role: Author

Shimon Morodooch

Shimon Morodooch

R&D Project Manager

Harmonic Video Networks

Role: Speaker

Alex Manukovsky

Alex Manukovsky

Technical lead, SI/PI team

Intel

Role: Speaker